【英文标准名称】:Insulationcoordinationforequipmentwithinlow-voltagesystems-Useofcoating,pottingormouldingforprotectionagainstpollution
【原文标准名称】:低压系统内设备的绝缘配合.防污染用涂覆,灌封或模压的使用
【标准号】:BSEN60664-3-2003+A1-2010
【标准状态】:现行
【国别】:英国
【发布日期】:2003-06-09
【实施或试行日期】:2003-06-09
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:涂层;定义(术语);尺寸选定;电气器具;电气工程;电驱动装置;绝缘配合;绝缘;低压设备;低压绝缘子;测量;印制电路;印制电路板;规范(验收);测试
【英文主题词】:Coatings;Definitions;Dimensioning;Electricappliances;Electricalengineering;Electrically-operateddevices;Insulationcoordination;Insulations;Low-voltageinstallations;Low-voltageinsulator;Measurement;Printedcircuits;Printed-circuitboards;Specification(approval);Testing
【摘要】:ThispartofIEC60664appliestoassembliesprotectedagainstpollutionbytheuseofcoating,pottingormoulding,thusallowingareductionofclearanceandcreepagedistancesasdescribedinPart1orPart5.Thisstandarddescribestherequirementsandtestproceduresfortwomethodsofprotection:–type1protectionimprovesthemicroenvironmentofthepartsundertheprotection;–type2protectionisconsideredtobesimilartosolidinsulation.Thisstandardalsoappliestoallkindsofprotectedprintedboards,includingthesurfaceofinnerlayersofmulti-layerboards,substratesandsimilarlyprotectedassemblies.Inthecaseofmulti-layerprintedboards,thedistancesthroughaninnerlayerarecoveredbytherequirementsforsolidinsulationinPart1.Thisstandardrefersonlytopermanentprotection.Itdoesnotcoverassembliesthataresubjectedtomechanicaladjustmentorrepair.Theprinciplesofthisstandardareapplicabletofunctional,basic,supplementaryandreinforcedinsulation.
【中国标准分类号】:K30
【国际标准分类号】:29_080_30
【页数】:28P.;A4
【正文语种】:英语